MEMS Fabrication

Chemical Mechanical Polish & Grind (CMP/Grind)

At the Strasbaugh 6EC

Processes & Equipment:

  • CMP - Strasbaugh 6EC
    • High selective polysilicon polish stopping on oxide or nitride
    • Silicon smoothing
    • High selective oxide polish stopping on nitride
    • RMS reduction of oxide silicon nitride or polysilicon
    • Ceria and silica slurries available
  • Grind - Strasbaugh nGenuity 7AAII

For a complete list of CMP Polish & Grind capabilities or to set up a consultation, contact us at 585.919.3000 or .