MEMS Fabrication

Etch Processes & Equipment

Plasma Etch:

  • STS ASE DRIE
  • LAM 9400
    • Silicon
    • Polysilicon
    • Polyimide
    • Metal
  • LAM 9600
    • Al
    • AlSi
    • AlSiCu
    • Ti
    • W
    • TiO2
    • SiO2
    • HfO2
    • Cr
    • Mo
    • AlN
  • LAM 4520
    • Nitride
    • Oxide

Programming the Ulvac

Wet Processing:

  • JST benches and Semi SRDs
    • HF
    • 6:1 BOE
    • Hot Phosphoric
    • KOH
    • PAN NMP
    • Liftoff

Resist Strip:

  • Ulvac and LAM HW - O2 plasma
  • Piranha
  • EKC 265

Additional Processes:

  • Xactix - XeF2 releases
  • Primax - Vapor HF

For a complete list of Etch capabilities or to set up a consultation, contact us at 585.919.3000 or .