MEMS Fabrication

Photolithography Processes

Inside the Photo Bay

Coat/Develop/Bake:

  • Positive resist
  • Negative resist (lift off)
  • Su8 and various polymides up to 100µ

Photolithography Equipment includes:

  • Ultratech Reduction Stepper with 0.50µm resolution
  • Ultratech 1X Stepper with backside alignment capability
  • KarlSuss Contact Aligner with backside alignment capability
  • TEL Track with HMDS and 3 coat bowls, 2 develop bowls, and 23 back or cure hot plates
  • SVG tracks for coat, bake, develops
  • Sink baths for batch develop processing
  • IR Inspection station with image capture and CD measurement software
  • Microscopes with image capture
  • Film thickness measurement equipment
  • SEM available

Processing Capabilities include:

  • Positive photo resist from 0.65µm to 25.0µm thicknesses
  • Negative photo resist for patterning and lift off
  • Specialty Films up to 100µm thicknesses
  • SU-8, Polyimide's, Low-K dielectrics, Barc, and CEM films available
  • Soft Bake, Post Exposure Bake, and curing to 350°C for both track and ovens available

For a complete list of Photolith capabilities or to set up a consultation, contact us at 585.919.3000 or .