Packaging

Make your product dream a reality.

The job doesn't stop with device fabrication. In fact, to maximize performance of a device, it's imperative to provide the optimal working environment and critical interfaces between a device and the external world. Microsystems devices will also need protection from hostile environments, and maintenance of the proper operating environment. Here at ITC, you can get all this—and more.

Our extensive Packaging capabilities include: Dicing, Wafer Level Bonding, Tailoring Surface Properties, Interconnections, Flip Chip Bonding, Optoelectronic Packaging, Adhesive Dispense, Reliability Testing.

Design your device using ITC's Microsystems packaging processes:

  • Make connections
    • Power
    • Sensing
    • Heating
    • Cooling
    • Photonic coupling
    • Fluid coupling & distribution
  • Create specialized environments
    • Hermetic
    • Vacuum
    • Inert gas
    • Chemically resistant
  • Tailor surfaces
    • Biocompatible
    • Hydrophobic
    • Hydrophilic
  • Provide mechanical support

Working with Packaging:


ITC has recently completed a $5M investment in new packaging capabilities. This investment has resulted in an overall facility that is unique and potent, combining the power of our MEMS Fabrication with our state-of-the-art capabilities in wafer bonding, dicing, and device level packaging for MEMS, BioMEMS, microfluidics, photonics and optoelectronics. In addition, we possess Class 100 and Class 1000 clean rooms designed for MEMS packaging operations, and a knowledgeable staff with expertise in process development and materials evaluation and selection.

With offerings from design through fabrication and packaging, ITC can serve as a full-service partner with you and your team to create new devices and systems. As the project matures beyond the initial prototypes, ITC can do pilot scale manufacturing; working with you to develop processes and refine designs to ensure a smooth transition to high volume manufacturing.


For a complete list of Packaging capabilities or to set up a consultation, contact us at 585.919.3000 or .