Packaging

Dicing

Equipment:

  • ADT 7200 fully automatic dicing with up to 300mm dicing capability for cutting silicon, glass, quartz, ceramic, and plastic.
  • Other features include low vibration dicing, grooving, milling, and slotting. Kerf size is as small as 20 µm for some material thicknesses.

For a complete list of Dicing capabilities or to set up a consultation, contact us at 585.919.3000 or .