Packaging

Optoelectronic Packaging

Capabilities:

  • Device Characterization
    • Mode field
    • Coupling efficiency
    • Optical gain
    • Polarization dependent gain
    • Saturation power
    • Noise figure
  • Waveguide Polishing
  • Fiber Joining
    • SMF, PM, MMF
    • Active alignment
    • Integration of fiber arrays
  • Submicron Precision Placement
  • Solder Deposition and Reflow
  • Hermetic Seam Sealing

For a complete list of Optoelectronic Packaging capabilities or to set up a consultation, contact us at 585.919.3000 or .