Packaging

Wafer Level Bonding

Cross-section of microfluidic device, 5 layer stack

Equipment:

  • Suss MicroTec ABC200 tool capable of wafer cleaning, surface activation, precision alignment, and bonding
  • Suss MA6/SB6
  • Vacuum laminator for adhesive bonding

Capabilities:

  • Silicon fusion
  • Anodic
  • Eutectic
  • Thermo-compression
  • Glass frit
  • Adhesive

For a complete list of Wafer Level Bonding capabilities or to set up a consultation, contact us at 585.919.3000 or .